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提供OEM&ODM散热器设计，量身打造符合您需求的解决方案

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Focused on research and production in the field of heat dissipation for 14 years

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产品广泛应用于国民生产，生活的各领域。家电家居、个人应用(手机、电脑)、智能汽车、互联网信息和大数据、5G通讯、医疗设备、工控安防等设施的散热应用均有我司产品和方案参与。

CPU Socket： AMD SP3 ILM
Solution： 2U Server and Up ( Active )
Dimensions： 120.0 x 80.0 x 63.5 mm
Power consumption： 165W (6800rpm) & 240W (9000rpm)

Parameters

CPU Socket： AMD SP3 ILM
Solution： 2U Server and Up ( Active )
Dimensions： 120.0 x 80.0 x 63.5 mm
Power consumption： 165W (6800rpm) & 240W (9000rpm)

Details

型号 (Model)	80803460
处理器架构 (CPU Socket)	AMD SP3 ILM
机箱架构 (Solution)	2U Server and Up ( Active )
尺寸 (Dimensions)	120.0 x 80.0 x 63.5 mm
功耗 (TDP)	165W (6800rpm) & 240W (9000rpm)
材质 (Material)	AL Base + Cu Block +AL Fin + 4HP + 6025 Fan
导热膏 (Thermal Grease)	Dow Corning TC-5218 Pre-Applied

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Focused on research and production in the field of heat dissipation for 14 years

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Focused on research and production in the field of heat dissipation for 14 years

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