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60601670

The inside of the temperature equalizing plate is sealed and filled with condensate. When the heating component generates heat, the evaporating end of the temperature equalizing plate in contact with the heat source will absorb this heat, causing the condensate to evaporate into gas. Due to the latent heat characteristics of water vapor, these gases will rapidly diffuse to the condensation end of the isothermal plate and release heat to the heat dissipation fins or radiators

CPU Socket： Intel Socket 2011 Narrow ILM
Power consumption： 135 W

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CPU Socket： Intel Socket 2011 Narrow ILM
Power consumption： 135 W

Details

型号 (Model)	60601670
处理器架构 (CPU Socket)	Intel Socket 2011 Narrow ILM
尺寸 (Dimensions)	93.0 x 91.4 x 7.0 mm
功耗 (TDP)	135 W
材质 (Material)	C1020

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Focused on research and production in the field of heat dissipation for 14 years

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