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CPU Socket AMD SP3 ILM
Solution 3U Server and Up ( Active )
Dimensions 120.0 x 95.0 x 126.3 mm
TDP 250W
Specification Video Application

型号   (Model)

J9

处理器架构   (CPU   Socket)

AMD SP3 ILM

机箱架构   (Solution)

3U Server and Up  ( Active )

尺寸   (Dimensions)

120.0 x 95.0 x 126.3 mm

功耗 (TDP)

250W

材质   (Material)

AL Base + Cu Block +AL Fin + 6HP + 9225 Fan

导热膏   (Thermal   Grease)

Dow Corning TC-5218 Pre-Applied


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